An All Solid-State MIC Transmit - Receive Module

This paper discusses the results obtained in the design and development of two breadboard solid-state MIC transmit-receive modules; the second unit being an improved version of the first unit. Attention will be focused on both results that were obtained, and the associated problems involved in the integration of several distinct components into a single module. The associated problem discussion will deal with two areas: 1) The difference in RF boundary conditions of a single component and of multiple components integrated into a single subsystem. 2) Fabrication difficulties as they related to integrating several components.