• DocumentCode
    2636455
  • Title

    Crosstalk and delay time analysis of high density interconnects on LTCC substrate

  • Author

    Orlandi, A. ; Antonini, G. ; Moca, C. ; Scogna, A. Ciccomancini

  • Author_Institution
    University of L´´Aquila
  • Volume
    3
  • fYear
    2006
  • fDate
    14-18 Aug. 2006
  • Firstpage
    686
  • Lastpage
    691
  • Keywords
    Application specific integrated circuits; Ceramics; Crosstalk; Delay effects; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Multiplexing; Performance analysis; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
  • Conference_Location
    Portland, OR, USA
  • Print_ISBN
    1-4244-0293-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.2006.1706397
  • Filename
    1706397
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2636455