• DocumentCode
    2636536
  • Title

    EMI model improvement taking LSI package structure into consideration

  • Author

    Ichikawa, Kazuhisa ; Unou, T. ; Tsuda, Toshitaka ; Mabuchi, Yusaku ; Nagata, M. ; Ichikawa, Kazuhisa

  • Author_Institution
    DENSO CORPORATION
  • Volume
    3
  • fYear
    2006
  • fDate
    14-18 Aug. 2006
  • Firstpage
    707
  • Lastpage
    711
  • Keywords
    Circuit noise; Circuit simulation; Electromagnetic compatibility; Electromagnetic interference; Large scale integration; Packaging; Pins; Power supplies; Power system modeling; Semiconductor device noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
  • Conference_Location
    Portland, OR, USA
  • Print_ISBN
    1-4244-0293-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.2006.1706401
  • Filename
    1706401
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2636536