• DocumentCode
    2637709
  • Title

    Modification Of Compact Bipolar Transistor Model For DFM (design For Manufacturing) Applications

  • Author

    Yoshitomi, S. ; Kawakyu, K. ; Teraguchi, T. ; Kimijina, H. ; Yonemura, K.

  • Author_Institution
    Toshiba Corp. Semicond. Co., Taipei
  • fYear
    2006
  • fDate
    22-24 June 2006
  • Firstpage
    125
  • Lastpage
    130
  • Abstract
    This paper describes the methodology of how to link process information with SPICE compact models. This is called DFM (design for manufacturing). We would like to propose "BJT physical model card" as a solution of DFM design of BiCMOS integrated circuit. This is a SPICE compact model card of bipolar transistors (HiCUM and Gummel-Poon), which utilizes link between model parameters and few process parameters (ex. base width, base doping concentration). Experimental formulae describing the effect of doping concentration on the bulk mobility, bulk resistance and diffusion coefficient are the main heart of this card. This enables circuit engineers perform the reasonable yield analysis prior to the mass production. Two adaptation examples were shown by the use of TOSHIBA\´s fT=45GHz SiGe BiCMOS technology. Its applicability was confirmed by the measurement data of single transistors and test circuit (3 stages power amplifier for 2.4GHz application)
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; bipolar transistor circuits; design for manufacture; integrated circuit modelling; 2.4 GHz; 45 GHz; BJT physical model card; BiCMOS integrated circuit; BiCMOS technology; SiGe; bipolar transistor model; design for manufacturing; model parameters; process information; yield analysis; BiCMOS integrated circuits; Bipolar transistors; Circuit testing; Design for manufacture; Doping; Heart; Integrated circuit modeling; SPICE; Semiconductor process modeling; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference
  • Conference_Location
    Gdynia
  • Print_ISBN
    83-922632-2-7
  • Type

    conf

  • DOI
    10.1109/MIXDES.2006.1706552
  • Filename
    1706552