• DocumentCode
    2638948
  • Title

    Thermal analysis and experimental validation on cooling efficiency of thin film transistor liquid crystal display (TFT-LCD) panels

  • Author

    Tavman, Ismail ; Turgut, Alpaslan ; Iz, Murat

  • Author_Institution
    Dept. of Mech. Eng., Dokuz Eylul Univ., Izmir, Turkey
  • fYear
    2011
  • fDate
    20-23 Oct. 2011
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    This research explored the thermal analysis and modeling of a 32” thin film transistor liquid crystal display (TFT-LCD) panel, in the purpose of making possible improvements in cooling efficiencies. The illumination of the panel was insured by 180 light emitting diodes (LEDs) located at the top and bottom edges of the panels. These LEDs dissipate high heat flux at low thermal resistance. Hence, in order to insure good image quality in panels and long service life, an adequate thermal management is necessary. For this purpose, a commercially available computational fluid dynamics (CFD) simulation software “FloEFD” was used to predict the temperature distribution. This thermal prediction by computational method was validated by an experimental thermal analysis by attaching 10 thermocouples on the back cover of the panel and measuring the temperatures. Also, thermal camera images of the panel by FLIR Thermacam SC 2000 test device were also analyzed.
  • Keywords
    LED displays; computational fluid dynamics; liquid crystal displays; thermal analysis; thermal resistance; thin film transistors; CFD simulation software FloEFD; FLIR Thermacam SC 2000 test device; LED; TFT-LCD Panels; computational fluid dynamic simulation software FloEFD; cooling efficiency; light emitting diodes; thermal analysis; thermal camera images; thermal management; thermal resistance; thermocouples; thin film transistor liquid crystal display panels; Electronic packaging thermal management; Light emitting diodes; Metals; TV; Temperature measurement; Thermal analysis; Thin film transistors; Computational fluid dynamics; FloEFD; TFT-LCD TV; Thermal simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
  • Conference_Location
    Timisoara
  • Print_ISBN
    978-1-4577-1276-0
  • Electronic_ISBN
    978-1-4577-1275-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2011.6102689
  • Filename
    6102689