Modification of interfacial properties between filler particles in electrically conductive adhesives

Many parameters of electrically conductive adhesives are worse in comparison with parameters of solders. Different ways of improvement of electrical conductivity of electrically conductive adhesives with isotropic electrical conductivity were examined: additional curing at the temperature of 120 °C for 10 minutes, sintering at the temperature of 240 °C for 5 minutes, high-speed rotary stirring for 3 minutes and 1300 rpm, and addition of HCOOH into adhesive. It was found that the most efficient way is the rotary stirring, which improved electrical conductivity of adhesive more than 20 times. On the other hand, addition of of HCOOH into adhesive and sintering have no positive effect.