• DocumentCode
    2639635
  • Title

    Simulation of printed thermoelectric generators using finite element analysis

  • Author

    Ionescu, C. ; Svasta, P. ; Bonfert, D.

  • Author_Institution
    Center for Technol. Electron. & Interconnection, Univ. Politeh. of Bucharest, Bucharest, Romania
  • fYear
    2011
  • fDate
    20-23 Oct. 2011
  • Firstpage
    235
  • Lastpage
    240
  • Abstract
    The paper presents the result of studies and investigations related to planar thermoelectric generators, intended to be realized through printing technologies. The recent development in printing technologies and materials makes possible the realization of thermoelectric pairs in planar configuration as an alternative to the already used devices. The use of printing technologies permits the realization of a higher density of structures, keeping the overall volume very low. The main problem is that the materials required to print the thermoelements are still under test and there was not yet found an optimal paste system solution. In the same time, the Seebeck coefficients are smaller in comparison with bulk materials. We have used the finite element software features in order to include thermoelectric generation effects. This was done by performing a thermal-electric coupled analysis for two type of layouts. One is a known complex configuration of thermoelectric module, for which a model validation exists and the other is a real planar configuration.
  • Keywords
    Seebeck effect; finite element analysis; thermoelectric conversion; Seebeck coefficients; bulk materials; finite element analysis; model validation; optimal paste system solution; planar configuration; planar thermoelectric generators; printed thermoelectric generators; thermoelectric pairs; Couplings; Finite element methods; Generators; Junctions; Load modeling; Materials; Temperature measurement; Finite element analysis; Multi-field Analysis; Printed thermocouples; Thermoelectric generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
  • Conference_Location
    Timisoara
  • Print_ISBN
    978-1-4577-1276-0
  • Electronic_ISBN
    978-1-4577-1275-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2011.6102725
  • Filename
    6102725