Design and implementation of MB-OFDM UWB modem

Author

Kim, Dohoon ; Lim, Yongseok ; Cho, Jinwoong ; Lee, Chungyong

Author_Institution

Korea Electron. Technol. Inst., Seongnam, South Korea

fYear

2011

fDate

9-12 Jan. 2011

Firstpage

419

Lastpage

420

Abstract

A multi-band orthogonal frequency division multiplexing (MB-OFDM) ultra-wideband (UWB) modem design for high speed wireless communication is presented. The media access control (MAC)/ physical layer (PHY) part of the developed chip is based on the WiMedia standard. ARM9 is adopted for high speed data transaction and USB 2.0 and SDIO are supported for host interface. The modem part occupies about half of the whole chip area, and is developed by using most of standard cells. 90nm CMOS technology is used and the chip size is about 5mm × 5mm. The power management mode is implemented to reduce the average power consumption.

Keywords

CMOS integrated circuits; OFDM modulation; access protocols; modems; peripheral interfaces; ultra wideband communication; ARM9; CMOS technology; MB-OFDM UWB modem; SDIO; USB 2.0; WiMedia standard; high speed data transaction; high speed wireless communication; media access control; multiband orthogonal frequency division multiplexing; physical layer part; power management mode; size 90 nm; ultrawideband modem; Chip scale packaging; Clocks; Modems; OFDM; Pins; Power demand; Universal Serial Bus;

fLanguage

English

Publisher

ieee

Conference_Titel

Consumer Electronics (ICCE), 2011 IEEE International Conference on

Conference_Location

Las Vegas, NV

ISSN

2158-3994

Print_ISBN

978-1-4244-8711-0

Type

conf

DOI

10.1109/ICCE.2011.5722660

Filename

5722660