DocumentCode
2642896
Title
Intelligent tires based on wireless passive surface acoustic wave sensors
Author
Zhang, Xiangwen ; Wang, Feiyue ; Wang, Zhixue ; Li, Wei ; He, Dongzhi
Author_Institution
Intelligent & Telematic Syst. Div., Chinese Acad. of Sci., Beijing, China
fYear
2004
fDate
3-6 Oct. 2004
Firstpage
960
Lastpage
964
Abstract
The structure and principle of an intelligent tire based on wireless passive surface acoustic wave (SAW) sensors are described. The SAW sensor is made by two identical delay lines on both sides of the substrate symmetrically. In each delay line, there were two reflectors with difference distance from interdigital transducer (IDT). The sensor was hermetically sealed in an all-quartz-package (APQ) technology and embedded in the tire. It can measure the tire pressure and temperature parameters automatically. According to the measurement result, the sensor systems can estimate the tire state intelligently and present the driver an alarm when the pressure or temperature was abnormal. The theory of measuring pressure and temperature is discussed and analysis for measures with pressures from 150 kPa to 300 kPa and temperatures from 25°C to 95°C is conducted. The results of measurement agree with the theory well.
Keywords
alarm systems; hermetic seals; interdigital transducers; pressure measurement; surface acoustic wave delay lines; surface acoustic wave sensors; temperature measurement; tyres; wireless sensor networks; 150 to 300 kPa; 25 to 95 degC; IDT; SAW sensor; alarm system; all-quartz-package technology; delay lines; intelligent tires; interdigital transducer; pressure measurement; reflectors; sensor systems; temperature measurement; wireless passive surface acoustic wave sensors; Acoustic sensors; Acoustic waves; Delay lines; Intelligent sensors; Intelligent structures; Pressure measurement; Surface acoustic waves; Temperature sensors; Tires; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Transportation Systems, 2004. Proceedings. The 7th International IEEE Conference on
Print_ISBN
0-7803-8500-4
Type
conf
DOI
10.1109/ITSC.2004.1399036
Filename
1399036
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