• DocumentCode
    2646996
  • Title

    Developing world class thermal solutions [for power electronics]

  • Author

    Kuzmin, Gary

  • Author_Institution
    Aavid Thermal Technol., Laconia, NH, USA
  • fYear
    1996
  • fDate
    25-27 Jun 1996
  • Firstpage
    490
  • Lastpage
    497
  • Abstract
    In building today´s electronic products, many of the sub-systems are designed and manufactured in various places around the world. They only come together at a top-level assembly plant. Here, the author argues that it is most important that designers take necessary steps to develop a sound prototyping process at the concept stage for new product designs. This will ensure that when products come together from several remote assembly locations, less re-design efforts will have to be expended on “after-the-fact” thermal management of the entire system. The underlying goal with all thermal modeling is to develop the most economic cooling system that delivers the most value with the highest reliability. Those companies that can effectively and unerringly merge subsystems together seamlessly will create the final product that is the most competitive
  • Keywords
    cooling; power electronics; product development; thermal analysis; cooling system; electronic products; power electronics; product designs; prototyping process; reliability; thermal management; value; Assembly systems; Buildings; Consumer electronics; Cooling; Design engineering; Electronics cooling; Heat engines; Manufacturing; Power electronics; Power generation economics; Process design; Product design; Prototypes; Reliability engineering; Thermal engineering; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southcon/96. Conference Record
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-8785
  • Print_ISBN
    0-7803-3268-7
  • Type

    conf

  • DOI
    10.1109/SOUTHC.1996.535114
  • Filename
    535114