DocumentCode
2646996
Title
Developing world class thermal solutions [for power electronics]
Author
Kuzmin, Gary
Author_Institution
Aavid Thermal Technol., Laconia, NH, USA
fYear
1996
fDate
25-27 Jun 1996
Firstpage
490
Lastpage
497
Abstract
In building today´s electronic products, many of the sub-systems are designed and manufactured in various places around the world. They only come together at a top-level assembly plant. Here, the author argues that it is most important that designers take necessary steps to develop a sound prototyping process at the concept stage for new product designs. This will ensure that when products come together from several remote assembly locations, less re-design efforts will have to be expended on “after-the-fact” thermal management of the entire system. The underlying goal with all thermal modeling is to develop the most economic cooling system that delivers the most value with the highest reliability. Those companies that can effectively and unerringly merge subsystems together seamlessly will create the final product that is the most competitive
Keywords
cooling; power electronics; product development; thermal analysis; cooling system; electronic products; power electronics; product designs; prototyping process; reliability; thermal management; value; Assembly systems; Buildings; Consumer electronics; Cooling; Design engineering; Electronics cooling; Heat engines; Manufacturing; Power electronics; Power generation economics; Process design; Product design; Prototypes; Reliability engineering; Thermal engineering; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Southcon/96. Conference Record
Conference_Location
Orlando, FL
ISSN
1087-8785
Print_ISBN
0-7803-3268-7
Type
conf
DOI
10.1109/SOUTHC.1996.535114
Filename
535114
Link To Document