• DocumentCode
    2648630
  • Title

    Congestion-driven floorplanning based on two-stage optimization

  • Author

    Mao, Fubing ; Ma, Yuchun ; Xu, Ning ; Liu, Shenghua ; Wang, Yu ; Hong, Xianlong

  • Author_Institution
    WuHan Univ. of Technol., Wuhan, China
  • fYear
    2009
  • fDate
    20-23 Oct. 2009
  • Firstpage
    1298
  • Lastpage
    1301
  • Abstract
    In current VLSI design, routing congestion becomes a critical issue with deep submicron design technology. In order to avoid the rip-up and reroute which is a time-consuming process after the placement stage, in this paper, we proposed a new two-stage floorplanning approach for congestion optimization. In our approach we use the method of probability-estimation which uses the extended bounding box to evaluate the routing of nets. We also take use of the strategy of cell perturb to eliminate the routing congestion. Further reduction in congestion is obtained by our algorithm which guided by congestion. We have tested our approach on the MCNC benchmark circuits. The experiments show that our algorithms is efficient, stable and can reduce congestion largely. Compared with the traditional congestion-driven floorplanning, our 2-stage approach can alleviate the congestion efficiently in much shorter time.
  • Keywords
    VLSI; benchmark testing; circuit layout; circuit optimisation; circuit testing; MCNC benchmark circuits; VLSI design; cell perturb; congestion optimization; congestion-driven floorplanning; deep submicron design technology; extended bounding box; probability-estimation; routing congestion; Circuit testing; Cost function; Delay; Design optimization; Equations; Integrated circuit interconnections; Minimization; Routing; Timing; Very large scale integration; Congestion reduction; Floorplanning; Routability; Routing estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2009. ASICON '09. IEEE 8th International Conference on
  • Conference_Location
    Changsha, Hunan
  • Print_ISBN
    978-1-4244-3868-6
  • Electronic_ISBN
    978-1-4244-3870-9
  • Type

    conf

  • DOI
    10.1109/ASICON.2009.5351235
  • Filename
    5351235