Memory process and test techniques for known good die

This paper discusses four methods of die mount into temporary packages that allow full electrical parameter and temperature range testing to be performed. For evaluation of each method an IDT 71B74 8K x 8-bit cache TAG RAM is used. The four methods are: 1) tape automated bonding (TAB); 2) temporary wirebond into traditional IC packages; 3) temporary contact with micro-probe packages; and 4) solder-bump attach/contact to die. A description of each method, along with benefits and short comings is provided. Applicability of each to either wire bond or flip chip manufacturing is also important to MCM designers. Start-up and long term production costs are presented