• DocumentCode
    2652568
  • Title

    Multilayer printing on PDMS-ceramic composites for RF integration and packaging

  • Author

    Apaydin, E. ; Zhou, Y. ; Koulouridis, S. ; Volakis, J.L. ; Hansford, Derek

  • Author_Institution
    Biomed. Eng. Dept., Nanotech West Lab., Columbus, OH, USA
  • fYear
    2009
  • fDate
    1-5 June 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we introduce a printing technique to reliably metallize PDMS-ceramic composites for multilayer integration. Strong polymer-metal adhesion and stable mechanical/RF performances are achieved via the following steps: (1) surface masking, (2) surface modification, (3) titanium adhesion layer and (4) electroplating. We note that the surface modification and electroplating are newly introduced steps to overcome above mentioned fabrication challenges and therefore making PDMS attractive for RF applications. Below, we discuss these steps and present two examples, a single-layer hybrid for circular polarization (CP) feeding and a patch antenna. Techniques for 3-D fabrication and multilayer integration are also elaborated using a hybrid-embedded GPS antenna and a multilayer microstrip directional coupler.
  • Keywords
    Global Positioning System; antenna feeds; composite materials; directional couplers; electroplating; integrated circuit packaging; microstrip antennas; printing; 3D fabrication; PDMS-ceramic composites; RF integration; RF packaging; circular polarization feeding; electroplating; hybrid-embedded GPS antenna; mechanical-RF performances; multilayer integration; multilayer microstrip directional coupler; multilayer printing; patch antenna; poly dimethyl siloxane composites; polymer-metal adhesion; surface masking; surface modification; titanium adhesion layer; Adhesives; Fabrication; Metallization; Microstrip antennas; Nonhomogeneous media; Packaging; Polymers; Printing; Radio frequency; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE
  • Conference_Location
    Charleston, SC
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4244-3647-7
  • Type

    conf

  • DOI
    10.1109/APS.2009.5172012
  • Filename
    5172012