• DocumentCode
    265456
  • Title

    Identify key grasping-related properties based on cutaneous electrotactile stimulation

  • Author

    Heng Xu ; Linjun Bao ; Dingguo Zhang ; Xiangyang Zhu

  • Author_Institution
    State Key Lab. of Mech. Syst. & Vibration, Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2014
  • fDate
    17-19 Sept. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    It is important to close the control loop by providing tactile feedback to prosthesis users. An increasing number of researchers attempt to improve grasping performance by providing various types of tactile feedbacks. In our study, we improve the performance by a virtual environment in which subjects acquire two key grasping-related properties, including object´s stiffness, economically holding power (Feco) that could stop the objects slipping by a minimum force, using pressure feedback and slipping feedback generated by electrotactile stimulation during they are grasping objects. Results indicate that this method is feasible. The accurate discrimination of two levels´ stiffness is 95.4%, and the accurate discrimination of four levels´ economically holding power (Feco) is 78.3%. Furthermore, in order to compare the discriminating performance, we investigate the confused types in discriminating the stiffness and the economically holding power (feco).
  • Keywords
    electromyography; neurophysiology; prosthetics; control loop; cutaneous electrotactile stimulation; discriminating performance; economically holding power; grasping performance; grasping-related properties; pressure feedback; prosthesis users; slipping feedback; tactile feedbacks; virtual environment; Accuracy; Educational institutions; Electromyography; Equations; Force; Grasping; Tactile sensors; Economically holding power; Electrotactile stimulation; Pressure feedback; Slipping feedback; Stiffness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Functional Electrical Stimulation Society Annual Conference (IFESS), 2014 IEEE 19th International
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4799-6482-6
  • Type

    conf

  • DOI
    10.1109/IFESS.2014.7036757
  • Filename
    7036757