Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads

Author

Li, Dezhi ; Liu, Changqing ; Conway, Paul P.

Author_Institution

Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ.

fYear

2006

fDate

27-28 June 2006

Firstpage

108

Lastpage

114

Abstract

The reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different pads on print circuit boards (PCBs) was studied through thermal cycling. Three different pads were studied, i.e. bare pads, pads with solder masks and pads with micro-via. After assembly, (Au,Ni)Sn4 intermetallics (IMCs) formed both in the bulk solder and at the interfaces due to the immersion-Au finish on the board side. The (Au,Ni)Sn4 IMCs formed in the solder joints on the pads with micro-via were more abundant than those formed in the solder joints on the pads without micro-via. Results showed that the solder joints on the pads with a micro-via had poor reliability due to insufficient solder volume and the formation of large amounts of (Au,Ni)Sn4 IMCs. For the pads with micro-via, the main location of failure was at the (Au,Ni)Sn4/solder interface on the chip side, and for the solder joints on bare pads and pads with solder mask, the possible failure location was in the bulk solder

Keywords

copper alloys; fine-pitch technology; flip-chip devices; printed circuits; reliability; silver alloys; solders; tin alloys; SnAgCu; connection pads; failure location; fine pitch technology; flip chip solder joints; print circuit boards; thermal cycling; Ash; Assembly; Atherosclerosis; Consumer electronics; Flip chip solder joints; Microstructure; Soldering; Temperature; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0488-6

Type

conf

DOI

10.1109/HDP.2006.1707575

Filename

1707575