Etch rates for Si-face 4H-SiC using H2 and a C3H8 partial pressure

In an effort to calibrate nitrogen incorporation into the growing layer, a nitrogen step-doped sample was grown. In an attempt to reduce or eliminate incidental etching during pre- and post- growth temperature ramps, additional samples were etched under different propane partial pressures. With increasing propane partial pressure the etch rate decreases.