High-speed thermal measurements of high-power diode arrays

Thermal analysis becomes increasingly important for investigating power management issues, and the ability to obtain thermal characteristics for various packaging approaches is even more critical. Therefore, this study includes experiments that examine power loads, self-heating effects, and large area thermal characteristics of a high-power diode array using a non-contact approach. Through high-speed infrared image capture, multi-dimensional thermal data is collected noninvasively while stressing the diode array. Thermal transients recorded were found to be sensitive to ambient temperature, power cycling, and heat sink employed.