• DocumentCode
    2662570
  • Title

    Comparison of Two Temporary Carriers for Test and Burn-In of Memory Die

  • Author

    Lindsey, Scott ; Williams, Bill ; Vasquez, Barbara ; Altuna, Bob ; VanOverloop, Don ; Walker, Scott

  • Author_Institution
    Motorola, Semiconductor Products Sector, Austin, TX
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    29
  • Lastpage
    33
  • Keywords
    Aluminum; Bonding; Burnishing; Contacts; Costs; Fixtures; Power system interconnection; Probes; Random access memory; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753525
  • Filename
    753525
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2662570