Implementation of Advanced Micro-Interconnection Technologies on a Thin-Film Multichip Module

Author

Interrante, M.J. ; Clearfield, H.M. ; Beckham, K.F. ; Economikos, L.

Author_Institution

IBM Federal Systems Company, NY

fYear

1994

fDate

13-15 Apr 1994

Firstpage

Lastpage

Keywords

Bonding forces; Dielectric substrates; Fiber lasers; Flip chip; Lead; Multichip modules; Power lasers; Testing; Transistors; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

DOI

10.1109/ICMCM.1994.753531

Filename

753531

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