A sub-surface metallization post-process IC module for RF technology

Author

Ng, Kiat T. ; Pham, Nga P. ; Rejaei, Behzad ; Sarro, Pasqualina M. ; Burghartz, Joachim N.

Author_Institution

Lab. of Electron. Components, Technol. & Mater, Delft Univ. of Technol., Netherlands

fYear

2000

fDate

2000

Firstpage

195

Lastpage

198

Abstract

A novel post-process bulk-micromachining module for sub-surface metallization is presented. The module provides an integrated radio-frequency (RF) ground plane at sufficient distance beneath the wafer surface and a frontside contact to that ground plane to integrate conductor-backed inductors and microstrips, as well as a trench structure for crosstalk suppression in RF circuits

Keywords

MMIC; crosstalk; electrical contacts; inductors; integrated circuit measurement; integrated circuit metallisation; interference suppression; isolation technology; micromachining; microstrip lines; RF circuits; RF technology; conductor-backed inductor integration; conductor-backed microstrip integration; crosstalk suppression; frontside contact; ground plane; integrated RF ground plane; integrated radio-frequency ground plane; post-process bulk-micromachining module; sub-surface metallization; sub-surface metallization post-process IC module; trench structure; wafer surface; Contacts; Crosstalk; Inductors; Metallization; Microstrip; Radio frequency; Radiofrequency integrated circuits; Silicon; Spirals; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar/BiCMOS Circuits and Technology Meeting, 2000. Proceedings of the 2000

Conference_Location

Minneapolis, MN

ISSN

1088-9299

Print_ISBN

0-7803-6384-1

Type

conf

DOI

10.1109/BIPOL.2000.886203

Filename

886203