DocumentCode
2662892
Title
Mechanical Punching of Through-Holes in Thin Laminates for Higher Density MCM-L Fabrication
Author
Tessier, T.G. ; Adams, Bill
Author_Institution
Unichem Industries Inc., California
fYear
1994
fDate
13-15 Apr 1994
Firstpage
173
Lastpage
181
Keywords
Copper; Costs; Dielectric substrates; Fabrication; Laminates; Manufacturing industries; Manufacturing processes; Pulp manufacturing; Punching; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN
0-930815-39-4
Type
conf
DOI
10.1109/ICMCM.1994.753547
Filename
753547
Link To Document