DocumentCode
2662917
Title
Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Author
Linz, Torsten ; Kallmayer, Christine ; Aschenbrenner, Rolf ; Reichl, Herbert
Author_Institution
Fraunhofer IZM, Berlin, Germany
fYear
2005
fDate
18-21 Oct. 2005
Firstpage
86
Lastpage
89
Abstract
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
Keywords
fabrics; intelligent materials; moulding; textile products; yarn; conductive yarn; electrical interconnect embroidering; fabric; flexible electronic modules; mold encapsulation; Circuit testing; Consumer electronics; Contacts; Fabrics; Flexible electronics; Flip chip; Integrated circuit interconnections; Textile technology; Wearable computers; Yarn;
fLanguage
English
Publisher
ieee
Conference_Titel
Wearable Computers, 2005. Proceedings. Ninth IEEE International Symposium on
Print_ISBN
0-7695-2419-2
Type
conf
DOI
10.1109/ISWC.2005.19
Filename
1550791
Link To Document