• DocumentCode
    2662917
  • Title

    Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric

  • Author

    Linz, Torsten ; Kallmayer, Christine ; Aschenbrenner, Rolf ; Reichl, Herbert

  • Author_Institution
    Fraunhofer IZM, Berlin, Germany
  • fYear
    2005
  • fDate
    18-21 Oct. 2005
  • Firstpage
    86
  • Lastpage
    89
  • Abstract
    This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
  • Keywords
    fabrics; intelligent materials; moulding; textile products; yarn; conductive yarn; electrical interconnect embroidering; fabric; flexible electronic modules; mold encapsulation; Circuit testing; Consumer electronics; Contacts; Fabrics; Flexible electronics; Flip chip; Integrated circuit interconnections; Textile technology; Wearable computers; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wearable Computers, 2005. Proceedings. Ninth IEEE International Symposium on
  • Print_ISBN
    0-7695-2419-2
  • Type

    conf

  • DOI
    10.1109/ISWC.2005.19
  • Filename
    1550791