• DocumentCode
    26630
  • Title

    Dielectric properties of polystyrene based composites filled with core-shell BaTiO3/polystyrene hybrid nanoparticles

  • Author

    Wang, Dongping ; Huang, Meng ; Zha, Jun-Wei ; Zhao, Junhua ; Dang, Zhi-Min ; Cheng, Zhongyuan

  • Author_Institution
    Department of Polymer Science and Engineering, School of Chemistry and Biological Engineering University of Science and Technology Beijing Beijing, 100083, China
  • Volume
    21
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug-14
  • Firstpage
    1438
  • Lastpage
    1445
  • Abstract
    In this work, core-shell structured BaTiO3/polystyrene nanoparticles (BT-PS) with different thickness of PS shell were synthesized through atom transfer radical polymerization and the influence of their shell thickness on dielectric properties of BTPS/ PS composites was studied. Two types of BT-PS with the PS shell of 3 nm or 12 nm were obtained by controlling the polymerization time. The structure of BT-PS was carefully characterized by infrared spectroscopy, X-ray diffraction, thermal gravimetric analysis, and transmission electron microscope. The results confirmed the successful preparation of core-shell BT-PS nanoparticles. Compared to pristine BT, the core-shell particles can be more homogeneously dispersed into PS matrix. As a result, higher dielectric constant, higher breakdown strength, and lower dielectric loss were achieved in BT-PS/PS composites. Moreover, the dielectric constant of BT-PS/PS composites displayed frequency independent behavior. In addition, the composites filled by BT-PS with 3 nm of PS shell showed better dielectric properties than those filled by BT-PS with 12 nm of PS shell. A maximum energy density as large as 4.24 J/cm3 was obtained in BT-PS/PS films.
  • Keywords
    Ceramics; Dielectric constant; Dielectric losses; Nanoparticles; Permittivity; Polymers; Dielectric properties; composite; core-shell structure; energy density; polystryrene.;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2013.004329
  • Filename
    6877968