DocumentCode

2663521

Title

Thin-Profile MCM-D Packaging for Small Form Factor Applications

Author

Bet-Shliemoun, Ashur ; McGraw, Mark ; Griswold, Brad ; Ho, Chung ; Westbrook, Scott

Author_Institution

MicroModule Systems, Inc., CA

fYear

1994

fDate

13-15 Apr 1994

Firstpage

461

Lastpage

463

Keywords

Assembly; Bonding; Copper; EPROM; Electronics packaging; Polyimides; Semiconductor films; Silicon; Sputtering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1994. Proceedings of the 1994 International Conference on

Print_ISBN

0-930815-39-4

Type

conf

DOI

10.1109/ICMCM.1994.753590

Filename

753590