• DocumentCode
    2663585
  • Title

    Capacitively Coupled Multichip Modules

  • Author

    Salzman, David B. ; Knight, Thomas F.

  • Author_Institution
    MIT Artificial Intelligence Laboratory
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    487
  • Lastpage
    494
  • Keywords
    Backplanes; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Packaging machines; Semiconductor device packaging; Substrates; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753594
  • Filename
    753594
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663585