• DocumentCode
    2663830
  • Title

    A 50mhz Multichip Processor Module With Flip Chip Technology

  • Author

    Miller, Bill ; Volkringer, Nick ; Su, Lo-Soun ; Ting, Yee Ming ; Loo, Mike ; Kumar, Ramesh ; Smith, Bruce

  • Author_Institution
    IBM Corporation, N.Y.
  • fYear
    1994
  • fDate
    13-15 Apr 1994
  • Firstpage
    583
  • Lastpage
    590
  • Keywords
    Electronic packaging thermal management; Electronics packaging; Flip chip; Foundries; Integrated circuit interconnections; Microelectronics; Multichip modules; Signal design; Sun; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1994. Proceedings of the 1994 International Conference on
  • Print_ISBN
    0-930815-39-4
  • Type

    conf

  • DOI
    10.1109/ICMCM.1994.753610
  • Filename
    753610
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2663830