• DocumentCode
    2666891
  • Title

    Parameterized MEMS device visualized modeling method-virtual assembly

  • Author

    Lei, Wang ; Xin, Zhao ; Guizhang, Lu

  • Author_Institution
    Inst. of Robot. & Autom. Inf. Syst., Nankai Univ., Tianjin
  • fYear
    2008
  • fDate
    16-18 July 2008
  • Firstpage
    351
  • Lastpage
    354
  • Abstract
    In the area of MEMS design, modeling and simulation of MEMS device are always the most popular topics and are also very important in MEMS design process. Due to the 3D microstructure and mechanical characteristic of MEMS device, the paper proposes a visualized modeling method for MEMS with parameterized components-Virtual Assembly. Virtual Assembly not only contains 3D topology construction and assembly, but also contains dynamic model synthesis for modeling the dynamic model of whole device. By using parameterized components in a component library, Virtual Assembly could assemble the 3D topology and dynamic model of MEMS device. The parameterized component library is the foundation of Virtual Assembly. Together with the visualized mechanical simulation tool-Virtual Operation, it could implement more flexible and rapid modeling and simulation of MEMS.
  • Keywords
    assembling; mechanical engineering computing; micromechanical devices; production engineering computing; virtual manufacturing; 3D topology construction; MEMS design process; component library; parameterized MEMS device; virtual assembly; virtual operation; visualized mechanical simulation tool; visualized modeling method; Assembly systems; Information systems; Integrated circuit modeling; Libraries; Microelectromechanical devices; Micromechanical devices; Robotic assembly; Robotics and automation; Topology; Visualization; MEMS; Parameterized model; Virtual assembly; Visualized modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control Conference, 2008. CCC 2008. 27th Chinese
  • Conference_Location
    Kunming
  • Print_ISBN
    978-7-900719-70-6
  • Electronic_ISBN
    978-7-900719-70-6
  • Type

    conf

  • DOI
    10.1109/CHICC.2008.4605566
  • Filename
    4605566