• DocumentCode
    2669466
  • Title

    2010 IEEE international reliability physics symposium

  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The following topics are dealt with: pMOSFET, high electron mobility transistors, and heterojunction bipolar transistors; optoelectronics thin films; light emitting diodes; phase change memory devices; dielectric breakdown; magnetic tunnel junction; electromigration; package design; radiation-induced pulse noise; CMOS technology; circuit reliability; industrial fault injection platform; thyristor-based memory cell; flash memory; failure analysis; single metal dual dielectric gate stacks; nanoelectronics; power devices; interconnect electro- and stress-migration; interconnect low-k; high-k gate dielectric; stress-induced leakage current; transistor hot carriers; micromechanical devices; electrostatic discharge; charge trapping NAND flash devices; and other thin film devices.
  • Keywords
    electrostatic discharge; failure analysis; flash memories; heterojunction bipolar transistors; high electron mobility transistors; light emitting diodes; micromechanical devices; optoelectronic devices; reliability; thin film devices; charge trapping NAND flash devices; circuit reliability; dielectric breakdown; electromigration; electrostatic discharge; failure analysis; flash memory; heterojunction bipolar transistors; high electron mobility transistors; high-k gate dielectric; industrial fault injection platform; interconnect low-k; light emitting diodes; magnetic tunnel junction; micromechanical devices; nanoelectronics; optoelectronics thin films; pMOSFET; phase change memory devices; power devices; single metal dual dielectric gate stacks; stress-induced leakage current; thyristor-based memory cell; transistor hot carriers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173210
  • Filename
    5173210