DocumentCode
2669844
Title
Degradation mechanisms beyond device self-heating in deep ultraviolet light emitting diodes
Author
Moe, Craig G. ; Reed, Meredith L. ; Garrett, Gregory A. ; Metcalfe, Grace D. ; Alexander, Troy ; Shen, Hongen ; Wraback, Michael ; Lunev, Alex ; Bilenko, Yuriy ; Hu, Xuhong ; Sattu, Ajay ; Deng, Jianyu ; Shatalov, Maxim ; Gaska, Remis
Author_Institution
Sensors & Electron Devices Directorate, U.S. Army Res. Lab., Adelphi, MD, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
94
Lastpage
97
Abstract
Lifetime measurements on single, packaged UV LEDs were performed under constant current injection at 20 and 75 mA (60 and 226 A/cm2). The junction temperature at operation was found by micro-Raman spectroscopy to be 57 and 184degC, respectively. Unbiased LEDs of similar characteristics placed in an oven baked at the equivalent operating junction temperatures showed a degradation in output power similar to that in the current injection devices during the initial 24 hours, but did not continue to degrade beyond that time. These studies imply that device heating, is correlated with the initial drop in output power during burn-in, but is not directly linked to the total degradation over the lifetime of the device. Time-resolved PL studies on the device active region as well as further electro-optic measurements indicate that the degradation is not due primarily to that of the active region, but may be associated with generation of point defects such as N-vacancies near the p-n junction.
Keywords
Raman spectroscopy; aluminium compounds; gallium compounds; light emitting diodes; wide band gap semiconductors; AlGaN; constant current injection; current 20 nA; current 75 nA; current injection devices; deep ultraviolet light emitting diodes; degradation mechanisms; device self-heating; electrooptic measurements; equivalent operating junction temperatures; microRaman spectroscopy; p-n junction; temperature 184 degC; temperature 57 degC; time 24 hour; unbiased LED; Degradation; Heating; Lifetime estimation; Light emitting diodes; Ovens; Packaging; Performance evaluation; Power generation; Spectroscopy; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173230
Filename
5173230
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