• DocumentCode
    2670018
  • Title

    Package design and material impact on board level reliability of fine pitch packages

  • Author

    Syed, Ahmer

  • Author_Institution
    Amkor, Chandler, AZ, USA
  • fYear
    2009
  • fDate
    26-30 April 2009
  • Firstpage
    155
  • Lastpage
    155
  • Abstract
    Summary form only given: The reliability of an electronic package is ultimately determined by the environment and application in which it is used. Due to the proliferation of electronic devices across market segments ranging from automotive to small, hand-held devices, electronic packages experience different loading conditions and thus need to pass varying reliability requirements. The gradual migration to Pb free, RoHS, and green packaging in various sectors of the industry is further challenging the manufacturers of electronic packages to provide reliable solutions with diverse material sets.
  • Keywords
    circuit reliability; electronics packaging; board level reliability; electronic devices; electronics package; fine pitch packages; green packaging; hand-held devices; package design; Automotive engineering; Composite materials; Consumer electronics; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Materials reliability; Surface finishing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2009 IEEE International
  • Conference_Location
    Montreal, QC
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-2888-5
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2009.5173242
  • Filename
    5173242