DocumentCode
2670018
Title
Package design and material impact on board level reliability of fine pitch packages
Author
Syed, Ahmer
Author_Institution
Amkor, Chandler, AZ, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
155
Lastpage
155
Abstract
Summary form only given: The reliability of an electronic package is ultimately determined by the environment and application in which it is used. Due to the proliferation of electronic devices across market segments ranging from automotive to small, hand-held devices, electronic packages experience different loading conditions and thus need to pass varying reliability requirements. The gradual migration to Pb free, RoHS, and green packaging in various sectors of the industry is further challenging the manufacturers of electronic packages to provide reliable solutions with diverse material sets.
Keywords
circuit reliability; electronics packaging; board level reliability; electronic devices; electronics package; fine pitch packages; green packaging; hand-held devices; package design; Automotive engineering; Composite materials; Consumer electronics; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Materials reliability; Surface finishing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173242
Filename
5173242
Link To Document