DocumentCode
2670978
Title
New perspectives of dielectric breakdown in low-k interconnects
Author
Yiang, Kok-Yong ; Yao, H. Walter ; Marathe, Amit ; Aubel, Oliver
Author_Institution
Technol. Reliability Dev., Adv. Micro Devices, Sunnyvale, CA, USA
fYear
2009
fDate
26-30 April 2009
Firstpage
476
Lastpage
480
Abstract
An alternative method of analyzing time-dependent dielectric breakdown (TDDB) data for low-k dielectrics is presented. The analysis shows that time to breakdown is well correlated to the Poole-Frenkel emission equation, and therefore the radicE-model is a more accurate model in describing the TDDB physics for low-k BEOL dielectrics.
Keywords
Poole-Frenkel effect; electric breakdown; integrated circuit interconnections; Poole-Frenkel emission equation; low-k BEOL dielectric interconnects; radicE-model; time-dependent dielectric breakdown; Dielectric breakdown; Dielectric measurements; Equations; LAN interconnection; Leakage current; Physics; Stress; Temperature distribution; Testing; Voltage; √E-model; BEOL; E-model; Time-dependent Dielectric Breakdown (TDDB); VRDB;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2009 IEEE International
Conference_Location
Montreal, QC
ISSN
1541-7026
Print_ISBN
978-1-4244-2888-5
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2009.5173299
Filename
5173299
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