Prevention of aluminum pad corrosion by UV/ozone cleaning

Author

Ahn, Seung-ho ; Cho, Tae-je ; Kim, Yoon-Soo ; Oh, Se-Yong

Author_Institution

Semicond. Bus, Samsun, Kiheung, South Korea

fYear

1996

fDate

28-31 May 1996

Firstpage

107

Lastpage

112

Abstract

One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated

Keywords

adhesion; aluminium; corrosion protection; delamination; integrated circuit metallisation; surface cleaning; Al; O₃; UV/ozone cleaning; aluminum bonding pad; chip molding compound adhesion; corrosion; delamination; integrated circuit; moisture concentration; Adhesives; Aluminum; Assembly; Atherosclerosis; Cleaning; Corrosion; Delamination; Moisture; Packaging; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517380

Filename

517380