• DocumentCode
    2673928
  • Title

    VLSI: the next ten years

  • Author

    Chatterjee, Pallab K.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1989
  • fDate
    17-19 May 1989
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    An examination is made of the various scenarios for the semiconductor industry over the next ten years. The following are anticipated. (1) Scaling will continue through the next decade, providing density improvements. (2) Significant structural material changes will be needed in building sub-half-micron ICs in order to continue performance and reliability improvements, especially if monolithic integration of multifunctions is envisioned (linear, power, nonvolatile functions with digital). (3) The cost of scaled silicon is increasing rapidly. Unless there is a fundamental change in this trend, the cost will be prohibitive. (4) A 100*-1000* improvement in design productivity is needed in the next decade to continue to cost-effectively design applications that utilize state-of-the-art technology. This may need a paradigm shift in the approach to IC design. (5) As scaled silicon becomes more expensive, advances in packaging, perhaps using older generation silicon technology, will provide the system-level cost improvement that will keep the application revolution going for the next decade.<>
  • Keywords
    VLSI; economics; electronics industry; integrated circuit manufacture; integrated circuit technology; technological forecasting; IC design; VLSI; design productivity; device scaling; monolithic integration; packaging; semiconductor industry; submicron ICs; system-level cost improvement; Application specific integrated circuits; Buildings; Cost function; Electronics industry; Materials reliability; Monolithic integrated circuits; Productivity; Semiconductor materials; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
  • Conference_Location
    Taipei, Taiwan
  • Type

    conf

  • DOI
    10.1109/VTSA.1989.68571
  • Filename
    68571