Connector stability test for small system connectors

An engineering study of connector performance using test procedures which incorporated current understanding of contact degradation modes is presented. Emphasis is placed on contact resistance stability during environmental aging under worst-case, simulated office conditions. Extensive studies on large sample sizes of commercial gold-plated connector systems shored that interface motion is a key element in any test methodology used to evaluate connector stability. This is analyzed in terms of the ability of each connector design to mechanically manage surface films and or wear debris to maintain metallic asperity contact. It is also determined that the evaluation of stability/reliability should be based on a distribution of contact resistance change limits over the range of 5 to 100 mΩ. This differs significantly from the more traditional approaches requiring that 100% of values are not to exceed a fixed limit. This approach represents a realistic balance between theory, practical measurement limitations, and practical hardware/field experience