• DocumentCode
    2674135
  • Title

    Electric contact performance: effects of contact surface morphology and the size of dust particles

  • Author

    Zhang, Ji-gao ; Yu, Ping

  • Author_Institution
    Res. Lab. of Electr. Contacts, Beijing Univ. of Posts & Telecommun., China
  • fYear
    1990
  • fDate
    20-24 Aug 1990
  • Firstpage
    402
  • Lastpage
    409
  • Abstract
    Dust deposition is influenced by many factors such as orientation of the coupon, electric static field, and permittivity of the lubricant which covers the coupon surface. Morphology of the surface is found to be an important factor which effects the dust size and density distribution curve: the rougher the surface, the larger the particles that are deposited. This phenomena is explained theoretically by means of the balance among various forces, including electric attracting force and mass gravity force of the dust particle. Experimental results showed that electric contact failure is closely related to the particle size and the morphology of the contact surface. Theoretical analysis indicates that there is a hazardous size range of the dust particles, within which dust particles are difficult to be moved away from the contact and thus cause the contact failure
  • Keywords
    dust; electrical contacts; balance among various forces; coupon orientation; dust deposition; dust difficult to remove; effects of contact surface morphology; electric attracting force; electric contact failure; electrical contact performance; electrostatic field; hazardous size range; lubricant permittivity; mass gravity force; size of dust particles; surface roughness; Copper; Electronics packaging; Failure analysis; Gravity; Probes; Rough surfaces; Surface contamination; Surface morphology; Surface roughness; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
  • Conference_Location
    Montreal, Que.
  • Type

    conf

  • DOI
    10.1109/HOLM.1990.113036
  • Filename
    113036