DocumentCode
2674252
Title
Simulation of Partial Discharges in Single and Double Voids Using SIMULINK
Author
Ren, C.Y. ; Cheng, Y.H. ; Yan, P. ; Sun, Y.H. ; Shao, T.
Author_Institution
Inst. of Electr. Eng., Chinese Acad. of Sci., Beijing
fYear
2006
fDate
14-18 May 2006
Firstpage
120
Lastpage
123
Abstract
Partial discharges (PD) in the insulation of power equipment have been a focal point in the field of electrical technology. Numerical simulation of PD is an important approach to knowing the PD mechanics. In this paper, the physical model of PD in voids was modified and the simulation circuit of PD in voids was built using Simulink. The simulations of the epoxy resin samples with a single void and double voids were investigated, respectively. The discharge voltage waveforms, discharge current waveforms, and the single discharge waveforms of voids were obtained by simulation. At the same time, we measured the PD pulse waveforms of epoxy resin samples in time-domain by an ultra-wideband PD measuring system. The test samples enclosing artificial voids have the same size as the simulation samples. The single discharge waveforms of a single void and double voids obtained by simulation are very similar to the measured ones in the same condition. Moreover, the different discharge rules between one void and two voids are found by simulation. The conformity of the simulation results and test ones indicates that the simulation model is effective and the simulation results are reliable
Keywords
insulation; partial discharges; polymers; power apparatus; PD measuring system; PD pulse waveforms; Simulink; discharge waveforms; epoxy resin sample; numerical simulation; partial discharge; power equipment insulation; single-double voids; Circuit simulation; Dielectrics and electrical insulation; Epoxy resins; Numerical simulation; Partial discharges; Pulse measurements; Testing; Time domain analysis; Time measurement; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Modulator Symposium, 2006. Conference Record of the 2006 Twenty-Seventh International
Conference_Location
Arlington, VA
Print_ISBN
1-4244-0018-X
Electronic_ISBN
1-4244-0019-8
Type
conf
DOI
10.1109/MODSYM.2006.365196
Filename
4216148
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