DocumentCode
2674539
Title
Future trend of ULSI technology and its influence on semiconductor industry
Author
Shibayama, Kyoichi
Author_Institution
Mitsubishi Electr. Corp., Hyogo, Japan
fYear
1989
fDate
17-19 May 1989
Firstpage
7
Lastpage
12
Abstract
Ultra-large-scale integrated circuits (ULSIs), in which more than 10 million active elements are embedded, will be realized in the early 1990s. The current status of candidate technologies supporting ULSI, such as lithography, film formation, interconnection and characterization of device structure, is examined. Problems left in the areas of design, testing, devices with physically new elements, and simplification of fabrication process to meet with performance, reliability, and economic requirements are discussed, and solutions are considered
Keywords
VLSI; electronics industry; integrated circuit manufacture; integrated circuit technology; IC production; ULSI technology; fabrication process; film formation; interconnection; lithography; semiconductor industry; CMOS technology; Cost function; Dielectric thin films; Electronics industry; Fabrication; Integrated circuit technology; Large scale integration; Random access memory; Research and development; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
Conference_Location
Taipei
Type
conf
DOI
10.1109/VTSA.1989.68572
Filename
68572
Link To Document