A multifunctional laser linking and cutting structure for standard 0.25 μm CMOS-technology

A novel laser-switch has been developed, designed and manufactured in a standard 6 level metal CMOS process. The redimensioned laser-switches combine a laser link and via (fuse) corresponding to minimum design rules in a single device. Due to vertical arrangement of the linking and the cutting structure (via), an area reduction of more than 30% is achieved, compared to laser arrays utilizing traditional laser structures. Simultaneous connecting and disconnecting reduces the processing time by 50%, since an additional process step is omitted. The resistance of the formed link structures is very low (R_12×12median=0.065 Ω, R_10×10median =0.118 Ω). Optimal values have been found for laser parameters to process the cutting structure with 100% yield. A first estimation of life-time results in t_0.1=22 a. Arrangements of laser-switches for bus configuration and repair, and for overwriting static configuration signals are proposed