DocumentCode
2678712
Title
Compressive imaging applied to infrared-based semiconductor failure analysis
Author
Sun, Ting ; Woods, Gary ; Kelly, Kevin F.
Author_Institution
ECE Dept., Rice Univ., Houston, TX, USA
fYear
2011
fDate
2-7 Oct. 2011
Firstpage
1
Lastpage
1
Abstract
We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.
Keywords
failure analysis; image reconstruction; infrared detectors; infrared imaging; semiconductor device reliability; IR analysis systems; IR emission images; compressive imaging; compressive sensing mathematics; defect detection; infrared-based semiconductor failure analysis; robust measurements; semiconductor devices; signal to noise ratio; single-element infrared photon detector; Compressed sensing; Detectors; Image coding; Image reconstruction; Imaging; Noise measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Conference_Location
Houston, TX
ISSN
2162-2027
Print_ISBN
978-1-4577-0510-6
Electronic_ISBN
2162-2027
Type
conf
DOI
10.1109/irmmw-THz.2011.6105248
Filename
6105248
Link To Document