DocumentCode
267887
Title
Polymer micromachining based on Cu On Polyimide substrate and its application to flexible MEMS sensor
Author
Niimi, Yosuke ; Shibata, Satoshi ; Shikida, Mitsuhiro
Author_Institution
Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Nagoya, Japan
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
528
Lastpage
531
Abstract
As a way of making a variety of flexible MEMS sensors, we developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate. The Cu etching characteristics of an iron (II) chloride solution were studied, and the results confirmed that etching in the depth and side directions strongly depended on the mask pattern and the etching time. A strip-shaped flexible thermal sensor was designed on the basis of the obtained etching results. One heater and two temperature sensors were designed for flow and acceleration sensors applications. The sensing metal on the polyimide thin membrane and the feed-through were successfully fabricated on the COP substrate.
Keywords
copper; etching; flow sensors; iron compounds; micromachining; microsensors; polymers; temperature sensors; COP substrate; Cu; Cu on polyimide substrate; FeO; acceleration sensors; cavity feed-through structures; electrical feed-through structures; flexible MEMS sensors; flow sensors; heater; iron chloride solution; mask pattern; polyimide thin membrane; polymer micromachining; sacrificial Cu etching; sensing metal; strip-shaped flexible thermal sensor; temperature sensors; Cavity resonators; Etching; Micromechanical devices; Polyimides; Substrates; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765694
Filename
6765694
Link To Document