Low temperature cofired ceramic (LTCC) for wireless applications

Author

Consolazio, S. ; Nguyen, K. ; Biscan, D. ; Vu, K. ; Ferek, A. ; Ramos, A.

Author_Institution

Northrop Grumman Corp., Rolling Meadows, IL, USA

fYear

1999

fDate

21-24 Feb. 1999

Firstpage

201

Lastpage

205

Abstract

This paper discusses the design and radiofrequency (RF)/microwave performance of low temperature cofired ceramic (LTCC) substrate technology for use in wireless applications. The advantages of multi-layer LTCC technology with integral embedded passives are clearly shown with wireless subsystem package designs in various formats including ball grid array (BGA) and low temperature cofired ceramic on metal (LTCC-M).

Keywords

MESFET integrated circuits; ball grid arrays; ceramic packaging; field effect MMIC; microwave amplifiers; multichip modules; printed circuits; transceivers; wideband amplifiers; C-band transceiver; LTCC substrate technology; LTCC-M; MESFET chip set; ball grid array; broadband high gain microwave amplifier; integral embedded passives; low temperature cofired ceramic; low temperature cofired ceramic on metal; metal semiconductor field effect transistor; multi-layer LTCC technology; radiofrequency/microwave performance; wireless LAN; wireless applications; wireless subsystem package designs; Assembly; Capacitors; Ceramics; Electronics packaging; Microwave technology; Radio frequency; Substrates; Temperature sensors; Transceivers; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Technologies for Wireless Applications, 1999. Digest. 1999 IEEE MTT-S Symposium on

Conference_Location

Vancouver, BC, Canada

Print_ISBN

0-7803-5152-5

Type

conf

DOI

10.1109/MTTTWA.1999.755162

Filename

755162