DocumentCode
267892
Title
Wafer scale fabrication of highly integrated rubidium vapor cells
Author
Overstolz, T. ; Haesler, J. ; Bergonzi, G. ; Pezous, A. ; Clerc, P.-A. ; Ischer, S. ; Kaufmann, Jens ; Despont, Michel
Author_Institution
Centre Suisse d´Electron. et de Microtech. (CSEM) SA, Neuchatel, Switzerland
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
552
Lastpage
555
Abstract
This paper reports on wafer scale fabrication of MEMS rubidium (Rb) vapor cells used for spectroscopic measurements in miniaturized atomic clocks. The cell filling process is based on pipetting minute amounts of dissolved rubidium azide (RbN3) into cavities etched in a silicon wafer, hermetic sealing of the cavities by anodic bonding of glass caps, and in situ UV decomposition of the RbN3 into Rb and N2. All relevant elements required for operation such as resistive heaters, temperature sensors, and coils are integrated onto the vapor cell using planar technology. Experiments showed short term frequency stability below 10-10 at 1 second integration time.
Keywords
atomic clocks; hermetic seals; micromechanical devices; planarisation; rubidium compounds; MEMS vapor cells; Rb; anodic bonding; cell filling process; coils; glass caps; hermetic sealing; highly integrated rubidium vapor cells; in situ UV decomposition; miniaturized atomic clocks; planar technology; resistive heaters; silicon wafer; spectroscopic measurements; temperature sensors; wafer scale fabrication; Atomic clocks; Atomic measurements; Cavity resonators; Frequency measurement; Glass; Heating; Metals;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765700
Filename
6765700
Link To Document