• DocumentCode
    267892
  • Title

    Wafer scale fabrication of highly integrated rubidium vapor cells

  • Author

    Overstolz, T. ; Haesler, J. ; Bergonzi, G. ; Pezous, A. ; Clerc, P.-A. ; Ischer, S. ; Kaufmann, Jens ; Despont, Michel

  • Author_Institution
    Centre Suisse d´Electron. et de Microtech. (CSEM) SA, Neuchatel, Switzerland
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    552
  • Lastpage
    555
  • Abstract
    This paper reports on wafer scale fabrication of MEMS rubidium (Rb) vapor cells used for spectroscopic measurements in miniaturized atomic clocks. The cell filling process is based on pipetting minute amounts of dissolved rubidium azide (RbN3) into cavities etched in a silicon wafer, hermetic sealing of the cavities by anodic bonding of glass caps, and in situ UV decomposition of the RbN3 into Rb and N2. All relevant elements required for operation such as resistive heaters, temperature sensors, and coils are integrated onto the vapor cell using planar technology. Experiments showed short term frequency stability below 10-10 at 1 second integration time.
  • Keywords
    atomic clocks; hermetic seals; micromechanical devices; planarisation; rubidium compounds; MEMS vapor cells; Rb; anodic bonding; cell filling process; coils; glass caps; hermetic sealing; highly integrated rubidium vapor cells; in situ UV decomposition; miniaturized atomic clocks; planar technology; resistive heaters; silicon wafer; spectroscopic measurements; temperature sensors; wafer scale fabrication; Atomic clocks; Atomic measurements; Cavity resonators; Frequency measurement; Glass; Heating; Metals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765700
  • Filename
    6765700