DocumentCode
267907
Title
Electrical characterization of ALD-coated silicon dioxide micro-hemispherical shell resonators
Author
Peng Shao ; Tavassoli, Vahid ; Chang-Shun Liu ; Sorenson, Logan ; Ayazi, Farrokh
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
612
Lastpage
615
Abstract
This paper reports on electrical characterization of ALD-coated thermally-grown silicon dioxide micro-hemispherical shell resonators (μHSRs) with capacitive electrodes. A high aspect ratio silicon dioxide μHSR with a thickness of 2.6 μm and diameter of 910 μm, uniformly coated with 30 nm of platinum using ALD process, demonstrated Q of 19,100 at 19.17 kHz and 14,300 at 55.2 kHz for m=2 and m=3 wineglass modes, respectively. An optimized isotropic dry etching recipe was developed to create highly symmetric hemispherical molds in (111) silicon substrates, from which the oxide shells were thermally grown. This resulted in a significant improvement of frequency mismatch between m=2 degenerate modes, achieving 21 Hz split as fabricated for m=2 modes of an 8kHz SiO2 μHSR that is 1240 μm in diameter and 2 μm in thickness. This creates a path for fabricating high Q and highly symmetric hemispherical shell resonators for microscale hemispherical resonator gyroscopes.
Keywords
electrochemical electrodes; etching; gyroscopes; micromechanical resonators; protective coatings; silicon compounds; μHSR; ALD-coated silicon dioxide; SiO2; capacitive electrodes; electrical characterization; frequency 19.17 kHz; frequency 55.2 kHz; frequency 8 kHz; gyroscopes; isotropic dry etching; microhemispherical shell resonators; platinum; silicon substrates; size 2 mum; size 2.6 mum; size 30 nm; size 910 mum; symmetric hemispherical molds; thermally-grown silicon dioxide; wineglass modes; Frequency measurement; Gyroscopes; Optical resonators; Q-factor; Resonant frequency; Silicon compounds; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765715
Filename
6765715
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