• DocumentCode
    2679127
  • Title

    3D Hall probe integrated in 0.35 μm CMOS technology for magnetic field pulses measurements

  • Author

    Pascal, Joris ; Hébrard, Luc ; Frick, VIncent ; Blondé, Jean-Philippe

  • Author_Institution
    Inst. d´´Electron. du Solide et des Syst., ULP Strasbourg, Strasbourg
  • fYear
    2008
  • fDate
    22-25 June 2008
  • Firstpage
    97
  • Lastpage
    100
  • Abstract
    This paper presents a 3 dimensional magnetometer based on Hall effect sensors integrated without any post processing in a standard low cost 0.35 mum CMOS technology. The system is dedicated to magnetic pulses measurements under a strong static field. Two vertical Hall devices (VHD) are sensitive to the components of the magnetic field oriented in the plane of the chip, while a horizontal Hall device (HHD) is sensitive to the component of the magnetic field orthogonally oriented to the plane of the chip. 3 identical instrumental chains are integrated to perform amplification of the 3 Hall voltages. The system implements a compensation of the static magnetic field and allows to measure magnetic fields pulses with a resolution of 79 muT over a [5 Hz - 1.6 kHz] bandwidth. Pulses are in the range from hundreds of muT to tens of mT in the frequency range from 1 Hz to 10 kHz. The static field is compensated up to 1.5 T. The spatial resolution is 44 mum. The system power consumption has been optimized to 15 mW.
  • Keywords
    CMOS integrated circuits; Hall effect devices; magnetic field measurement; 3 dimensional magnetometer; 3D Hall probe; CMOS technology; frequency 1 Hz to 10 kHz; horizontal Hall device; magnetic field pulses measurements; power 15 mW; size 0.35 mum; vertical Hall devices; CMOS process; CMOS technology; Costs; Hall effect devices; Magnetic field measurement; Magnetometers; Pulse amplifiers; Pulse measurements; Semiconductor device measurement; Spatial resolution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-2331-6
  • Electronic_ISBN
    978-1-4244-2332-3
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2008.4606330
  • Filename
    4606330