• DocumentCode
    267937
  • Title

    Fabrication and characterization of all hydrogel cantilevers for atomic force microscopy applications

  • Author

    Il Lee ; Jungchul Lee

  • Author_Institution
    Dept. of Mech. Eng., Sogang Univ., Seoul, South Korea
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    733
  • Lastpage
    736
  • Abstract
    This paper reports a novel method for fabricating hydrogel based microcantilevers by using dynamic mask lithography. A hydrogel, polyethyleneglycol diacrylate (PEGDA), was introduced between two parallel polydimethylsiloxane (PDMS) guides then cured with ultra-violet (UV) exposure to intended shape and size defined by the dynamic mask; an image sent from a PC to a liquid crystal display projector. One PDMS guide has an embedded glass piece which serves as a handle for the microcantilever and the other guide is with or without an inverted pyramid tip mold to fabricate tip-integrated or tipless microcantilevers, respectively. After fabricated hydrogel microcantilevers were thoroughly characterized by using a stylus profilometer and an atomic force microscope (AFM), they were employed for both contact and non-contact mode AFM imaging. In case of non-contact mode, the imaging performance of hydrogel AFM cantilevers was comparable to that of commercial silicon AFM cantilevers.
  • Keywords
    atomic force microscopy; cantilevers; hydrogels; lithography; microfabrication; micromechanical devices; PDMS; PEGDA; atomic force microscopy application; commercial silicon AFM cantilevers; contact-noncontact mode AFM imaging; dynamic mask lithography; hydrogel-based microcantilever fabrication; liquid crystal display projector; parallel polydimethylsiloxane; polyethyleneglycol diacrylate; stylus profilometer; tip-integrated microcantilevers; tipless microcantilevers; ultraviolet exposure; Fabrication; Force; Glass; Imaging; Lithography; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765745
  • Filename
    6765745