• DocumentCode
    267948
  • Title

    Out-of-plane micro triple-hot-wire anemometer based on Pyrex bubble for airflow sensing

  • Author

    Shuwei Liu ; Shanshan Pan ; Fei Xue ; Nay Lin ; Haobin Liu ; Jianmin Miao ; Norford, Leslie K. ; Lim, H.B.

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    777
  • Lastpage
    780
  • Abstract
    The paper reports novel design and fabrication of out-of-plane micro airflow sensors based on the hot-wire sensing principle, i.e. gas cooling of electrically-heated wires. Three micro Ti/Au/Cu hot-wire resistors have been fabricated on an out-of-plane Pyrex bubble with height of 300 μm. They are arranged 120 degrees apart on the sidewall of a bubble at height of 100 μm for airflow velocity and direction detection. Air velocity around the out-of-plane bubble structure has been investigated for square and circular package designs. The sensor with axisymmetric circular package has demonstrated the ability to detect velocity (<;10 m/s) and to determine flow direction with an error less than ±8° when the velocity is 10m/s. The sensitivity could be further improved in a new design with increased bubble height (1 mm) and elevated hot-wire resistor position (500 μm), according to the modeling results.
  • Keywords
    anemometers; bubbles; flow measurement; flow sensors; microfabrication; microsensors; packaging; resistors; two-phase flow; wires (electric); Ti-Au-Cu; airflow velocity; axisymmetric circular package; electrically heated wires; elevated hot wire resistor; flow direction detection; gas cooling; hot wire sensing principle; micro hot wire resistors fabrication; out-of-plane Pyrex bubble; out-of-plane bubble structure; out-of-plane micro airflow sensor fabrication; out-of-plane micro airflow sensors design; out-of-plane micro triple-hot wire anemometer; size 100 mum; size 300 mum; square package design; Atmospheric modeling; Fluid flow measurement; Resistors; Sensor phenomena and characterization; Thermal sensors; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765756
  • Filename
    6765756