DocumentCode
267952
Title
Smart-cut 6H-silicon carbide (SiC) microdisk torsional resonators with sensitive photon radiation detection
Author
Rui Yang ; Ladhane, Kalyan ; Zenghui Wang ; Jaesung Lee ; Young, Douglas J. ; Feng, Philip X.-L
Author_Institution
Electr. Eng., Case Western Reserve Univ., Cleveland, OH, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
793
Lastpage
796
Abstract
This digest paper reports experimental demonstration of a new type of microdisk torsional resonators based on a smart-cut 6H-silicon carbide (6H-SiC) technology. We carefully calibrate the thermomechanical vibrations of these torsional-mode resonators by employing highly sensitive laser interferometric readout techniques, with displacement sensitivities (i.e., limits of detection) at the levels of Sx1/2~0.1pmWHz and smaller. To utilize these first 6H-SiC torsional resonators, we further demonstrate sensitive detection of radiations from both blue (405nm) and infrared (IR 785nm) photons Toward force detection applications which torsional resonators are suitable, our measurements demonstrate an intrinsic force resolution of SF1/2≈5 7fN√Hz and a torque resolution of ST1/2≈3.7×10-20 (N·m)√Hz, limited by the fundamental thermomechanical fluctuations.
Keywords
calibration; force measurement; force sensors; light interferometry; microcavities; microfabrication; microsensors; optical resonators; radiation detection; silicon compounds; vibration measurement; wide band gap semiconductors; 6H-SiC technology; SiC; calibration; force detection application; intrinsic force resolution measurement; laser interferometric readout technique; sensitive photon radiation detection; smart-cut 6H-silicon carbide microdisk torsional resonator; thermomechanical vibration; torque resolution; torsional-mode resonator; wavelength 405 nm; wavelength 785 nm; Micromechanical devices; Optical resonators; Photonics; Resonant frequency; Shape; Silicon carbide; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765760
Filename
6765760
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