OMCVD TiN diffusion barrier for copper contact and via/interconnects structures

Author

Marcadal, C. ; Richard, E. ; Torres, Juana ; Palleau, J. ; Ulmer, L. ; Perroud, L.

Author_Institution

GRESSI CNET/FT

fYear

1997

fDate

16-19 March 1997

Firstpage

Lastpage

Keywords

Atherosclerosis; Conductivity; Copper; Metallization; Microstructure; Semiconductor materials; Silicon; Stability; Tin; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

DOI

10.1109/MAM.1998.887511

Filename

887511

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