• DocumentCode
    268043
  • Title

    Carbon SP2-SP3 technology: Graphene-on-diamond thin film UV detector

  • Author

    Kaiyuan Yao ; Chen Yang ; Xining Zang ; Fei Feng ; Liwei Lin

  • Author_Institution
    Berkeley Sensor & Actuator Center, Univ. of California, Berkeley, Berkeley, CA, USA
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    1159
  • Lastpage
    1162
  • Abstract
    This work presents a graphene-diamond-metal thin film system as ultraviolet (UV) light sensor on a flexible substrate. New scientific and engineering breakthroughs are: (1) first experimental investigation of electrical and optical properties of carbon-based sp2-sp3 (graphene-diamond) junction; (2) a peel-and-stick fabrication process to make flexible diamond thin films from CVD-grown micro crystalline diamond (MCD) wafers; and (3) a sandwich-like vertical sensor structure with graphene as a transparent top electrode, and metal (Ti-Au) as an ohmic bottom contact electrode. As such, the proposed detector/architecture can open up a new class of scheme to build diamond-based, attachable, portable and wearable optoelectronic systems.
  • Keywords
    chemical vapour deposition; diamond; flexible electronics; gold; graphene; metallic thin films; ohmic contacts; optical fabrication; photodetectors; thin film sensors; titanium; transparency; ultraviolet detectors; C-C-Ti-Au; CVD grown microcrystalline diamond; MCD wafers; attachable optoelectronic systems; carbon SP2-SP3 junction technology; diamond-based optoelectronic systems; electrical property; flexible diamond thin films; flexible substrate; graphene-on-diamond thin film UV detector; ohmic bottom contact electrode; optical property; peel and stick fabrication process; portable optoelectronic systems; sandwich like vertical sensor structure; transparent top electrode; ultraviolet light sensor; wearable optoelectronic systems; Detectors; Diamonds; Electrodes; Films; Graphene; Heterojunctions; Photodetectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765852
  • Filename
    6765852
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=268043