DocumentCode
268072
Title
Polycide contact interface to suppress squegging in micromechanical resoswitches
Author
Yang Lin ; Ruonan Liu ; Wei-Chang Li ; Nguyen, Clark T.-C
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, Berkeley, CA, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
1273
Lastpage
1276
Abstract
The use of a Pt-silicide-based contact interface has greatly reduced impact-induced energy loss in comb-driven resonant micromechanical switches (a.k.a., resoswitches) to the point where squegging phenomena (whereby impacts do not occur on every cycle) are eliminated, so no longer constrain the clock frequency of recently demonstrated mechanical charge pumps [1]. This opens the application range of such charge pumps to power converters capable of delivering currents much higher than the low current-draw MEMS dc-biasing applications targeted by [1]. The key to eliminating squegging in the present work is contact engineering, where softer contact materials, including Au, Ag, and Ni, steal too much energy on each impact; but harder contact materials, like Pt-silicide, allow more elastic impact while still maintaining low contact resistance due to the large impulsive force generated by impact - a distinct advantage of the resoswitch over conventional non-resonant counterparts.
Keywords
charge pump circuits; contact resistance; gold; micromechanical resonators; microswitches; nickel; platinum; silicon compounds; silver; Ag; Au; Ni; Pt-SiO2; clock frequency; comb-driven resonant micromechanical switches; contact engineering; harder contact materials; large impulsive force; low contact resistance; low current-draw MEMS dc-biasing applications; mechanical charge pumps; platinum-silicide-based contact interface; polycide contact interface; power converters; reduced impact-induced energy loss; squegging suppression; Charge pumps; Contacts; Logic gates; Materials; Micromechanical devices; Nickel; Resonant frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765881
Filename
6765881
Link To Document